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PCB Assembly Electro Mech. Assy. Military & Telecom Quality Control Backplanes

 

 

Backplanes

 

Backplanes and Motherboards: We are seasoned in all aspects of backplane and press-fit assembly.  Call us if you want personalized care for your difficult program.  Whether you call them midplanes, motherboards, activeplanes, backpanels, or backplanes, these special assemblies have their share of technical challenges.  Altronics specializes in challenging interconnection technology manufacturing solutions.

 

Backplane Assembly

Surface Mount (SMT)

Wave Solder

Press-Fit

Buss-bars

Telcordia

 

 

Thick Backplanes:  The high layer counts typically found in  backplanes equates to greater overall thickness of the PCB.  Altronics process is capable of handling these "thermally challenged" boards!  Backplane innerlayer feature design optimization is critical to allow for proper wetting when through hole soldering is required. We offer manufacturability design review support from design through new product introduction, and into production. We want to help you optimize the reliability of your backplane assembly!

 

Large Backplanes:  Some backplane designs exceed the typical overall form factors that most SMT equipment is designed for.  We have capability that allow us to process backplane assemblies with form factors up to 34+ inches.  We can surface mount, solder, and press-fit large your large backplane.  

 

 

 

 

Computerized Force Controlled 

Press-Fit Connector Insertion

 on Backplane with SPC Control

 

 

Press Fit Connectors:  The heart of many backplane designs are the thousands of compliant pins that make up it's communication superhighway. Press fit connectors offer reliable gas tight joints that require special tooling, fixturing and experience to insert properly.  We can engineer, and provide cost effective press-fit connector installation.  Our special presses offer insertion force control that can detect changes in process parameters such as board thickness, hole size, or connector variation. 

 

Special Materials:  Some backplane designs require the use of special materials and surface finishes when standard FR4 or solder coating will not meet the challenge.  We have experience processing exotic materials and non standard finishes such as gold, nickel, and OSP.

 

Altronics - Full Service Backplane Assembly

 

 

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Backplane DFM Design for Manufacturability Review

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SMT and TH processing of Backplane PCB Thickness from .093” to .300”+

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Backplane High layer counts

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Press Fit connector insertion force control

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Processing special Backplane PCB materials

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Bellcore /  Telcordia requirements

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Large form factor boards and backplanes 28”+

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Heavy thermal heat sinking inner layers

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Press-fit connectors, power bugs and studs, etc.

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Bussbars, wires and cables

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We can design special backplane fixturing and tooling

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Odd-form components

 

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BIG & Tall Shop

Our “Big and Tall” process is designed to handle the special assembly requirements of your  large and/or thick backplane.. 

 

  From our large form factor SMT line and wave solder equipment, to our computerized press fit connecter insertion equipment.

 

 Altronics is your partner for backplane assembly!

   

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12 Executive Drive, Unit 2, Hudson NH 03051

Located minutes from the Massachusetts border in Southern New Hampshire
Info@AltronicsMfg.com    603-577-8855