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PCB Assembly

 

SURFACE MOUNT AND THROUGH HOLE PCB ASSEMBLY 

 

Flexible, High tech PCB Assembly in New England!  High mix, and high technology capable.  We have a fully automatic Surface Mount process as well as complete Through Hole assembly capability.  

 

Our SMT process features outstanding equipment from the leaders in our industry.  We feature DEK stencil printing, BTU reflow, BGA X-Ray, and a Mydata Synergy line with two placement machines.  Each piece of equipment has been selected with specialized options that when combined as a complete process, sets us clearly apart from the competition.  

 

We have designed our automated PCB assembly processes to allow for quick changeovers and flexibility as well as mid-high volume runs. We can handle BGA, CGA, 04-02 chips, fine pitch components, as well as through hole, odd-form components and press-fit components and connectors.  Our process is environmentally friendly using aqueous washable and no–clean chemistries. Special PCB Substrate Materials processing is no problem!

 

 

 

 

PCB ASSEMBLY CAPABILITIES BY PROCESS TYPE

 

 

STENCIL PRINTING:  Control of the Stencil Printing Process is a critical step to high quality solder joints on each PCB Assembly.  Altronics has both fully automatic and semi- automatic printers. We have programmable solder paste inspection for fine pitch and BGA, as well as laser based measurement to insure paste height control.  We also have specialized equipment to handle large board printing requirements. 

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SMT COMPONENT PLACEMENT: Mydata equipment is known for flexibility! We have two machines conveyorized in-line! Our Mydata Synergy line makes one plus one equal three! One Mydata machine features large board format capability, and the other high speed chip shooter placement rates.  Both machines can run together with a combined maximum speed of over 10,000 components per hour.  This process offers outstanding process control, as well as high speed. This configuration also allows flexibility to run both machines independently for prototypes, small lot sizes, and a high mix of jobs. Our BGA X-ray machine inspects each Ball Grid Array device.

 

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THROUGH HOLE COMPONENTS:  We install all types of through hole components using several different methods.  We have 2 computer controlled Contact systems CS-400 component locators that allow repeatable process controlled builds from 1 piece to 1000+.  Programmable ultraclinch mechanism allows programmable lead trim lengths and angle of each component lead.  We also can use traditional progressive build slide-line style methodologies where appropriate for your PCB assembly.

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REFLOW: Our brand new BTU Pyramax reflow oven features special 24” process width, computer controlled process recipes, variable speed controlled cooling, and lead free capability. This machine was built to our custom configuration requirements by BTU.

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WAVE SOLDER: Dual wave system loaded with features including Vectra convection preheat, our full size Electrovert Ultrapack 650 can gently solder the toughest PCB assembly!  

 

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CLEANING:  Our processes are environmentally friendly.  We use a combination of aqueous cleanable, and also no-clean chemistries in our process to provide a perfect solution for every application.  Our Electrovert Aquastorm aqueous closed-loop cleaner sports an optional Hurricane High Pressure Wash to insure products are squeaky clean and free from flux residues and ionic contamination.

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PRESS-FIT (Connectors):  Look no further! Altronics is your PCB Assembly Press Fit Specialist! We are seasoned in all aspects of Press Fit assembly. Our state of the art Press Fit insertion equipment offers computerized insertion force control, and SPC data tracking. 

 

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Conformal Coating: 

We provide several types of coating, and encapsulation options based on your specifications.  Complete coating or localized precision dispensed encapsulation is available

 

 

Blacklight illuminating Conformal Coating coverage

 

 

 

 

RoHS /  Lead-Free:  The European Union Directives call for removal of several potentially hazardous substances.  Compliance will be enforced in the EU by July 1st 2006.  Many customer in the US who sell the European community are requesting "lead-free" products. Exemptions exist for military and other products.

 

Altronics has always been committed to a environmentally friendly "green" manufacturing operation, and has a mature Lead-Free Manufacturing process.  We currently have Lead-Free soldering capability in all  areas of manufacturing including Surface Mount and Thru-hole assembly.

 

Our ISO documented procedures insure that we control as aspects of the Lead-free process build including  materials and assembly processes.

 

 

 

 

 

 

 

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12 Executive Drive, Unit 2, Hudson NH 03051

Located minutes from the Massachusetts border in Southern New Hampshire
Info@AltronicsMfg.com    603-577-8855